JPH02114165U - - Google Patents
Info
- Publication number
- JPH02114165U JPH02114165U JP2182889U JP2182889U JPH02114165U JP H02114165 U JPH02114165 U JP H02114165U JP 2182889 U JP2182889 U JP 2182889U JP 2182889 U JP2182889 U JP 2182889U JP H02114165 U JPH02114165 U JP H02114165U
- Authority
- JP
- Japan
- Prior art keywords
- immersion
- jet
- circuit board
- running surface
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 9
- 238000007654 immersion Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2182889U JPH02114165U (en]) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2182889U JPH02114165U (en]) | 1989-02-27 | 1989-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02114165U true JPH02114165U (en]) | 1990-09-12 |
Family
ID=31239401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2182889U Pending JPH02114165U (en]) | 1989-02-27 | 1989-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02114165U (en]) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62155591A (ja) * | 1985-12-27 | 1987-07-10 | シャープ株式会社 | 基板の表裏同時半田付け方法 |
-
1989
- 1989-02-27 JP JP2182889U patent/JPH02114165U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62155591A (ja) * | 1985-12-27 | 1987-07-10 | シャープ株式会社 | 基板の表裏同時半田付け方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH02114165U (en]) | ||
JPS5853182U (ja) | 自動はんだ付け装置 | |
JPH02118690U (en]) | ||
JPS5853185U (ja) | 自動はんだ付け装置 | |
JPS648773U (en]) | ||
JPH01171668U (en]) | ||
JPS5851472U (ja) | 自動はんだ付け装置 | |
JPS6230380U (en]) | ||
JPS58157266U (ja) | はんだ付け装置 | |
JPS63136352U (en]) | ||
JPS6240869U (en]) | ||
JPS5896863U (ja) | フラツクス塗布装置 | |
JPS62170674U (en]) | ||
JPS5866676U (ja) | 自動はんだ付け装置 | |
JPS60146567U (ja) | 自動はんだ付け装置 | |
JPS59138265U (ja) | チツプ部品の実装装置 | |
JPS5853183U (ja) | 自動はんだ付け装置 | |
JPS59162162U (ja) | 噴流式はんだデイップ装置 | |
JPS58160663U (ja) | 自動はんだ付け装置 | |
JPH0356120U (en]) | ||
JPH0228363U (en]) | ||
JPS63145557U (en]) | ||
JPS6089966U (ja) | ハンダ槽 | |
JPS6325259U (en]) | ||
JPS5853184U (ja) | 自動はんだ付け装置 |